UHV Sputtering System
Name: AJA UHV six-source sputtering system
Type: Sputtering System
This system uses a magnetron sputtering source to create a plasma. Argon atoms in the plasma become ionized and are driven by the eclectic field to collide with a ‘target’ made of a high purity material such as copper. The collision causes copper atoms to be blasted away from the target and toward the sample substrate where they are deposited. Sub-nanometer layers can be deposited with 2% uniformity across a 3” wafer. This system has six sputtering sources in the main chamber and one additional source in the load lock.