Equipment—Etching

Reactive Ion Etcher (RIE 80)
Reactive Ion Etcher (RIE 80)
Name: Oxford Plasma Lab 80 Plus RIE (Ar, O2, CF4, CHF3, SF6)
Mfr.: Oxford Instruments
Model: Plasma Lab 80 Plus
Type: Reactive Ion Etcher
The Plasma Lab 80 Plus uses a plasma to create ions from gas molecules such as Oxygen (O2), Tetrafluoromethane (CF4), Trifluoromethane (CHF3) and Sulfur Hexafluoride (SF6). The ions are driven by the eclectic field toward the sample surface where they collide and cause some of the sample atoms to be blasted away (just like sputtering.) The ions also react chemically with the surface where the products, which include some of the surface material, are all volatile and result in etching of the surface. If the surface is coated with a mask, a patterned polymer layer, the system can be set up so that the exposed surface etches much more quickly than the mask; when the mask layer is removed the pattern is left etched into the sample surface.